3M Diamond Resin Wheel 664BK is used for high performance grinding of carbide cutting tools. It has superior form retention and runs with water-based coolant. From 100 to 400 mesh grits and dual grit - (120/320).Cut Faster, Finish Better
Our resin bonded diamond wheels are designed for high performance grinding on carbide. The 3M™ Diamond Resin Wheel 664BK line is specifically designed for the production and sharpening of cutting tools, including end work, gashing and cutting primary and secondary relief edges. Primary relief involves removing material directly behind the cutting edge to enhance chip clearance. For secondary relief, a slight bevel is ground next to the primary relief. End work grinds a small relief angle on the tip of the tool, while gashing adds a slot along the cutting face to allow for chip flow.
Resin Bonds Designed for the Application
These superabrasive wheels also use a resin bond, a fast cutting, resilient and inexpensive bond with high resistance to heat. Resin bonds are more able to disperse heat away from the cutting surface through the coolant. They are excellent for precision work on tool metals like carbide. This also allows for faster cuts and a higher cut rate. Use in wet grinding applications with high volume flood coolant systems on CNC or offhand applications.
The Right Wheel for the Job
3M™ Superabrasive Wheels are available in a variety of constructions, each with its own unique characteristics. We can help you find the 3M Wheel with the best balance of form retention and cut rate for your application.
The correct combination of cutting speed, feed rate, and conditioning interval are essential in order to fully utilize the performance offered by a grinding wheel.
3M provides a broad portfolio of superabrasive feature a variety of metal cores, including aluminum, steel, composite and copper, and can be cut with custom arbor holes to fit customer specifications. From short runs and re-sharpening to “lights-out” and long production runs, 3M has the wheel design to meet your needs.