Cycom® 754 has been developed to provide long out-life at ambient temperatures, combined with excellent mechanical properties generated at low cure temperatures.
Cycom® 754 is a modified epoxy resin which has been specifically developed for versatile cures under vacuum only conditions; it can also be cured under pressure if required.
The cure cycle can be adapted to suit the application, provided a full cure is eventually obtained – if a structure such as a hull needs to be cured in various stages, a partial cure can be done for the initial steps, provided the final laminate schedule undergoes a full cure cycle. This will not reduce the mechanical properties of the structure in any way.
FM® 754 is an adhesive film that has been developed to co-cure with the Cycom® 754 prepregs. It can also be used for secondary bonding applications where necessary.
